Patent Assignment
Reel/Frame 056626/0707
Assignment of Assignor's Interest
Recorded: 2021-06-23
Pages: 4
Assignors
HUNG, YI-TSE
Executed: 2021-05-14
CHOU, ANG-SHENG
Executed: 2021-05-12
CHIANG, HUNG-LI
Executed: 2021-05-12
CHEN, TZU-CHIANG
Executed: 2021-05-16
CHENG, CHAO-CHING
Executed: 2021-05-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof