Patent Assignment
Reel/Frame 056635/0727
Assignment of Assignor's Interest
Recorded: 2021-06-23
Pages: 9
Assignors
KAO, MIN-FENG
Executed: 2019-09-06
YAUNG, DUN-NIAN
Executed: 2019-09-18
LIN, HSING-CHIH
Executed: 2019-09-18
LIU, JEN-CHENG
Executed: 2019-09-17
TSAI, WEI-TAO
Executed: 2019-09-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming Shield Structure for Backside Through Substrate Vias (Tsvs)