Patent Assignment
Reel/Frame 056637/0661
Assignment of Assignor's Interest
Recorded: 2021-06-23
Pages: 4
Assignors
LI, SHU-WEI
Executed: 2020-10-30
YANG, SHIN-YI
Executed: 2020-10-30
LEE, MING-HAN
Executed: 2020-10-30
SHUE, SHAU-LIN
Executed: 2020-10-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure with Hybrid Barrier Layer