Patent Assignment
Reel/Frame 056640/0557
Assignment of Assignor's Interest
Recorded: 2021-06-23
Pages: 5
Assignors
YANG, TSU CHING
Executed: 2021-06-20
YANG, FENG-CHENG
Executed: 2021-06-07
LAI, SHENG-CHIH
Executed: 2021-05-31
JIANG, YU-WEI
Executed: 2021-05-30
CHIANG, KUO-CHANG
Executed: 2021-05-30
SUN, HUNG-CHANG
Executed: 2021-05-31
WU, CHEN-JUN
Executed: 2021-05-30
LIN, CHUNG-TE
Executed: 2021-05-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
High Selectivity Isolation Structure for Improving Effectiveness of 3D Memory Fabrication