Patent Assignment
Reel/Frame 056651/0616
Assignment of Assignor's Interest
Recorded: 2021-06-24
Pages: 5
Assignors
OGAWA, KENICHI
Executed: 2021-05-24
OKIMOTO, NAOKO
Executed: 2021-05-24
NAGAE, MITSUTAKA
Executed: 2021-05-24
SAKATA, MAKIKO
Executed: 2021-05-26
MIYOSHI, TORU
Executed: 2021-05-24
Assignee
DAI NIPPON PRINTING CO., LTD.
1-1, ICHIGAYA-KAGA-CHO 1-CHOME, SHINJUKU-KU, TOKYO-TO, JAPAN
Covered Property
(1)
Wiring Board and Method for Manufacturing Wiring Board