Patent Assignment
Reel/Frame 056651/0909
Assignment of Assignor's Interest
Recorded: 2021-06-24
Pages: 3
Assignor
HOI, SIEW KIT
Executed: 2021-06-21
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property
(1)
Process Kit Having Tall Deposition Ring and Smaller Diameter Electrostatic Chuck (Esc) for Pvd Chamber
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 24, 2021
From: GUNTHER, DAVID; SAVANDAIAH, KIRANKUMAR NEELASANDRA
To: APPLIED MATERIALS, INC.
Reel/Frame 056651/0744 →
Assignment of Assignor's Interest
Oct 15, 2021
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 057806/0282 →