IP Library Assignment 056661/0544
Patent Assignment
Reel/Frame 056661/0544

Assignment of Assignor's Interest

Recorded: 2021-06-24 Pages: 4
Assignors
SEDDON, MICHAEL J.
Executed: 2015-01-27
CARNEY, FRANCIS J.
Executed: 2015-01-27
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Packages with an Intermetallic Layer
Application: 17/304,715 →
Publication: US 2021/0327843
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 2, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 057054/0706 →
Release of Security Interest in Patents Recorded at Reel 057054, Frame 0706 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064083/0001 →