IP Library › Assignment 056666/0264
Patent Assignment
Reel/Frame 056666/0264

Assignment of Assignor's Interest

Recorded: 2021-06-25 Pages: 8
Assignor
HENKEL IP AND HOLDING GMBH
Executed: 2021-05-01
Assignee
TCLAD TECHNOLOGY CORPORATION
NO. 81-1, GONGYE RD., TOUFEN CITY, MIAOLI COUNTY, 351, TAIWAN
Covered Properties (5)
High Temperature, Conductive Thermosetting Resin Compositions
Finned Heat Sinks
Patent: 6,650,215 →
Application: 10/172,877 →
Thermal Diffusion Apparatus
Patent: 6,898,084 →
Application: 10/621,697 →
Publication: US 2005/0013119
Laminate Sub-Mounts for LED Surface Mount Package
Patent: 9,379,298 →
Application: 14/505,557 →
Publication: US 2016/0099392
Laminate Sub-Mounts for Led Surface Mount Package
Patent: 9,853,199 →
Application: 15/042,927 →
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 6, 2014
From: TAYLOR, STEVE; KOLBE, JUSTIN
To: THE BERGQUIST COMPANY
Reel/Frame 033890/0583 →
Assignment of Assignor's Interest Jun 3, 2015
From: THE BERGQUIST COMPANY
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035779/0071 →
Assignment of Assignor's Interest Feb 17, 2016
From: KOLBE, JUSTIN; TAYLOR, STEVE
To: THE BERGQUIST COMPANY
Reel/Frame 037750/0423 →
Assignment of Assignor's Interest Feb 17, 2016
From: THE BERGQUIST COMPANY
To: HENKEL IP & HOLDING GMBH
Reel/Frame 037750/0456 →
Assignment of Assignor's Interest Feb 4, 2022
From: TCLAD TECHNOLOGY CORPORATION
To: TCLAD INC.
Reel/Frame 058898/0920 →