Patent Assignment
Reel/Frame 035779/0071
Assignment of Assignor's Interest
Recorded: 2015-06-03
Pages: 16
Assignor
THE BERGQUIST COMPANY
Executed: 2015-03-25
Assignee
HENKEL IP & HOLDING GMBH
HENKELSTRASSE 67, DUSSELDORF, 40589, GERMANY
Covered Properties
(29)
Thermal Diffusion Apparatus
PCT:
PCT/US2004/017781 ↗
Thermally and Electrically Conductive Interconnect Structures
PCT:
PCT/US2008/087997 ↗
Thermal Interface with Non-Tacky Surface
PCT:
PCT/US2008/088009 ↗
Method for Mounting Thermal Interface Materials
PCT:
PCT/US2010/035524 ↗
Battery Cell Coatings
PCT:
PCT/US2014/062601 ↗
Thermally Conductive Filled Polymer Composites for Mounting Electronic Devices and Method of Application
Application:
08/445,303 →
Semisolid Thermal Interface with Low Flow Resistance
Patent:
5,950,066 →
Application:
08/663,800 →
Thermally Conductive Filled Polymer Composites for Mounting Electronic Devices and Method of Application
Patent:
6,090,484 →
Application:
08/848,955 →
"Thermal Interfaces for Electronic Devices"
Patent:
6,197,859 →
Application:
09/016,768 →
Method of preparing thermally conductive compounds by liquid metal bridged particle clusters
Patent:
6,339,120 →
Application:
09/543,661 →
Method of Preparing Thermally Conductive Compounds by Liquid Metal Bridged Particle Clusters
Patent:
6,624,224 →
Application:
09/690,994 →
Morphing Fillers and Thermal Interface Materials
Finned Heat Sinks
Patent:
6,650,215 →
Application:
10/172,877 →
Flexible Surface Layer Film for Delivery of Highly Filled or Low Cross-Linked Thermally Conductive Interface Pads
Patent:
6,657,297 →
Application:
10/219,210 →
Thermal Interface Pad Utilizing Low Melting Metal with Retention Matrix
Thermal Diffusion Apparatus
Morphing Fillers and Thermal Interface Materials
Patent:
39,992 →
Application:
11/122,210 →
Thermally and Electrically Conductive Interconnect Structures
Thermal Interface with Non-Tacky Surface
Method for Packaging Thermal Interface Materials
Thermal Interface with Non-Tacky Surface
Method for Packaging Thermal Interface Materials
Thermally Conductive Emi Suppression Compositions
Method for Packaging Thermal Interface Materials
Application:
13/855,268 →
Publication:
US 2013/0221014
Battery Cell Coatings
Application:
14/085,391 →
Publication:
US 2015/0140411
Thermally Conductive Dielectric Interface
Thermal Interface Material with Mixed Aspect Ratio Particle Dispersions
Laminate Sub-Mounts for LED Surface Mount Package
Thermally Conductive Dielectric Interface
Application:
61/839,116 →
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 3, 2013
From: MISRA, SANJAY; TIMMERMAN, JOHN; SEETHAMRAJU, KASYAP
To: THE BERGQUIST COMPANY
Reel/Frame 029563/0142 →
Assignment of Assignor's Interest
Dec 9, 2014
From: BERGERSON, STEVEN E.
To: THE BERGQUIST COMPANY
Reel/Frame 034435/0644 →
Assignment of Assignor's Interest
Dec 9, 2014
From: ELAHEE, GM FAZLEY; MISRA, SANJAY
To: THE BERGQUIST COMPANY
Reel/Frame 034435/0829 →
Assignment of Assignor's Interest
Dec 9, 2014
From: MISRA, SANJAY
To: THE BERGQUIST COMPANY
Reel/Frame 034435/0925 →
Assignment of Assignor's Interest
Dec 9, 2014
From: JEWRAM, RADESH; MCINTOSH, WILLIAM E.; SCHMITZ, JEREMY J.
To: THE BERGQUIST COMPANY
Reel/Frame 034436/0030 →
Assignment of Assignor's Interest
Dec 9, 2014
From: JEWRAM, RADESH; MISRA, SANJAY
To: THE BERGQUIST COMPANY
Reel/Frame 034434/0516 →
Assignment of Assignor's Interest
Jun 25, 2021
From: HENKEL IP AND HOLDING GMBH
To: TCLAD TECHNOLOGY CORPORATION
Reel/Frame 056666/0264 →
Assignment of Assignor's Interest
Feb 4, 2022
From: TCLAD TECHNOLOGY CORPORATION
To: TCLAD INC.
Reel/Frame 058898/0920 →
Assignment of Assignor's Interest
Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →