Patent Assignment
Reel/Frame 056673/0465
Assignment of Assignor's Interest
Recorded: 2021-06-25
Pages: 4
Assignors
HUANG, JUI-CHIEN
Executed: 2021-05-25
CHIANG, KUO-CHENG
Executed: 2021-05-25
WANG, CHIH-HAO
Executed: 2021-05-25
JU, SHI NING
Executed: 2021-05-25
CHEN, GUAN-LIN
Executed: 2021-06-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Methods of Forming the Same