Patent Assignment
Reel/Frame 056674/0790
Assignment of Assignor's Interest
Recorded: 2021-06-25
Pages: 6
Assignors
OKADA, ANJU
Executed: 2021-06-18
AMANO, MINA
Executed: 2021-06-18
YATAGAWA, KIYOSHIRO
Executed: 2021-06-18
FUKUDA, TAKAHISA
Executed: 2021-06-22
Assignee
TAIYO YUDEN CO., LTD.
7-19 KYOBASHI 2-CHOME, CHUO-KU, TOKYO, 104-0031, JAPAN
Covered Property
(1)
Electronic Component, Circuit Board Arrangement and Method of Manufacturing Electronic Component