Patent Assignment
Reel/Frame 056679/0614
Assignment of Assignor's Interest
Recorded: 2021-06-26
Pages: 4
Assignor
LI, XINYU
Executed: 2021-06-26
Assignees
SHANGHAI IC R&D CENTER CO., LTD.
497 GAOSI ROAD, ZHANGJIANG HIGH-TECH PARK, PUDONG, SHANGHAI, 201210, CHINA
SHANGHAI INTEGRATED CIRCUIT EQUIPMENT & MATERIALS INDUSTRY INNOVATION CENTER CO., LTD
NO. 497, LOULU ROAD, JIADING INDUSTRIAL ZONE, SHANGHAI, CHINA
Covered Property
(1)
Bonding Cavity Structure and Bonding Method