Patent Assignment
Reel/Frame 056693/0222
Assignment of Assignor's Interest
Recorded: 2021-06-28
Pages: 8
Assignors
JEONG, JAEWOO
Executed: 2021-06-09
IKHTIAR, -
Executed: 2021-06-09
APALKOV, DMYTRO
Executed: 2021-06-10
SAMANT, MAHESH
Executed: 2021-06-18
FERRANTE, YARI
Executed: 2021-06-18
FILIPPOU, PANAGIOTIS CHARILAOS
Executed: 2021-06-18
GARG, CHIRAG
Executed: 2021-06-25
Assignees
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Insertion Layers for Perpendicularly Magnetized Heusler Layers with Reduced Magnetic Damping