IP Library › Assignment 056701/0294
Patent Assignment
Reel/Frame 056701/0294

Assignment of Assignor's Interest

Recorded: 2021-06-28 Pages: 4
Assignors
LEE, DONG HWAN
Executed: 2021-04-21
CHA, HYE YEON
Executed: 2021-04-21
YOON, CHAN
Executed: 2021-04-21
LEE, DONG JIN
Executed: 2021-04-21
KIM, HWI DAE
Executed: 2021-04-21
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Coil Component
Application: 17/360,154 →
Publication: US 2022/0102047