Patent Assignment
Reel/Frame 056704/0870
Assignment of Assignor's Interest
Recorded: 2021-06-29
Pages: 3
Assignors
CHEN, MING-FA
Executed: 2021-06-27
CHEN, HSIEN-WEI
Executed: 2021-06-24
CHEN, YING-JU
Executed: 2021-06-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method of Forming Thereof