Patent Assignment
Reel/Frame 056711/0197
Assignment of Assignor's Interest
Recorded: 2021-06-29
Pages: 6
Assignors
SIM, JAERYONG
Executed: 2021-05-24
CHUNG, GIYONG
Executed: 2021-05-24
OH, DONGSIK
Executed: 2021-05-24
HAN, JEEHOON
Executed: 2021-05-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same