Patent Assignment
Reel/Frame 056718/0728
Assignment of Assignor's Interest
Recorded: 2021-06-30
Pages: 6
Assignors
LIU, HSING-CHIH
Executed: 2021-06-22
ZENG, ZHENG
Executed: 2021-06-23
KUO, CHE-HUNG
Executed: 2021-06-21
Assignee
MEDIATEK INC.
NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package Structure