Patent Assignment
Reel/Frame 056721/0623
Assignment of Assignor's Interest
Recorded: 2021-06-30
Pages: 7
Assignors
PARK, SUNG SIK
Executed: 2021-02-05
KIM, SANG JIN
Executed: 2021-02-08
OH, TAE HWAN
Executed: 2021-02-08
LEE, HYUN JEONG
Executed: 2021-02-05
JANG, SUNG JIN
Executed: 2021-06-18
JEONG, GYU MIN
Executed: 2021-02-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including an Element Separation Structure