Patent Assignment
Reel/Frame 056726/0905
Assignment of Assignor's Interest
Recorded: 2021-06-30
Pages: 3
Assignors
SHEN, HSIANG-KU
Executed: 2021-06-20
WANG, LIANG-WEI
Executed: 2021-06-20
CHEN, DIAN-HAU
Executed: 2021-06-20
CHEN, YEN-MING
Executed: 2021-06-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices and Method of Forming the Same