Patent Assignment
Reel/Frame 056747/0291
Assignment of Assignor's Interest
Recorded: 2021-07-02
Pages: 5
Assignor
KIM, JIHOON
Executed: 2021-06-17
Assignee
SAMSUNG ELECTRONICS CO, LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Utilizing a Hybrid Bonding Process and Method of Manufacturing the Same