Patent Assignment
Reel/Frame 056756/0447
Assignment of Assignor's Interest
Recorded: 2021-07-06
Pages: 3
Assignors
SHEN, HSIANG-KU
Executed: 2021-06-20
LIN, KU-FENG
Executed: 2021-06-20
WANG, LIANG-WEI
Executed: 2021-06-20
CHEN, DIAN-HAU
Executed: 2021-06-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packages and Method of Manufacturing the Same