Patent Assignment
Reel/Frame 056757/0463
Assignment of Assignor's Interest
Recorded: 2021-07-02
Pages: 4
Assignors
PARK, SEONG-SIK
Executed: 2021-04-26
KIM, GYUTAE
Executed: 2021-04-26
PARK, SAN
Executed: 2021-04-26
LEE, SUNG SOO
Executed: 2021-04-26
Assignee
SAMSUNG DISPLAY CO., LTD.
1, SAMSUNG-RO, GIHEUNG-GU,, YONGIN-SI, GYEONGGI-DO,, 17113, KOREA, REPUBLIC OF
Covered Property
(1)
Conductive Bonding Structure for Substrates and Display Device Including the Same