Patent Assignment
Reel/Frame 056761/0574
Assignment of Assignor's Interest
Recorded: 2021-07-06
Pages: 7
Assignors
LIM, SEUNGMAN
Executed: 2021-02-24
JUNG, HAKCHUL
Executed: 2021-02-24
BAEK, SANGHOON
Executed: 2021-02-24
SEO, JAEWOO
Executed: 2021-02-24
YU, JISU
Executed: 2021-02-24
YOU, HYEONGYU
Executed: 2021-02-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit and Method of Designing the Same