Patent Assignment
Reel/Frame 056765/0227
Assignment of Assignor's Interest
Recorded: 2021-07-06
Pages: 3
Assignor
HUANG, YU-LIEN
Executed: 2021-06-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof