Patent Assignment
Reel/Frame 056768/0243
Assignment of Assignor's Interest
Recorded: 2021-07-07
Pages: 6
Assignors
WENG, CHUNG-MING
Executed: 2021-05-25
YU, CHEN-HUA
Executed: 2021-05-27
LIU, CHUNG-SHI
Executed: 2021-05-26
TSAI, HAO-YI
Executed: 2021-06-08
HSIEH, CHENG-CHIEH
Executed: 2021-05-25
KUO, HUNG-YI
Executed: 2021-05-28
YU, TSUNG-YUAN
Executed: 2021-05-25
LIN, HUA-KUEI
Executed: 2021-05-28
HU, YU-HSIANG
Executed: 2021-05-25
JOU, CHEWN-PU
Executed: 2021-05-25
KUO, FENG-WEI
Executed: 2021-05-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Optical Interconnect Structure, Package Structure and Fabricating Method Thereof