Patent Assignment
Reel/Frame 056773/0562
Assignment of Assignor's Interest
Recorded: 2021-07-07
Pages: 2
Assignor
YOSHINO, KENJI
Executed: 2021-06-16
Assignee
SHOWA DENKO PACKAGING CO., LTD.
31, SUZUKAWA, ISEHARA-SHI, KANAGAWA, 259-1146, JAPAN
Covered Property
(1)
Laminated Body for Power Storage Device Outer Packaging Material
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.