Patent Assignment
Reel/Frame 056775/0578
Assignment of Assignor's Interest
Recorded: 2021-07-07
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
System and Method for Bonding Semiconductor Devices