IP Library › Assignment 056794/0470
Patent Assignment
Reel/Frame 056794/0470

Assignment of Assignor's Interest

Recorded: 2021-07-08 Pages: 3
Assignors
KATKAR, RAJESH
Executed: 2020-01-23
UZOH, CYPRIAN EMEKA
Executed: 2020-01-23
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Multi-Metal Contact Structure
Application: 17/370,576 →
Publication: US 2021/0335737
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 8, 2021
From: KATKAR, RAJESH; UZOH, CYPRIAN EMEKA
To: INVENSAS BONDING TECHONOLGIES, INC.
Reel/Frame 056796/0016 →
Security Interest May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Change of Name Oct 12, 2023
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 065221/0007 →