Patent Assignment
Reel/Frame 056797/0673
Assignment of Assignor's Interest
Recorded: 2021-07-08
Pages: 2
Assignor
OHTANI, KINYA
Executed: 2021-06-24
Assignee
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
2-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-0004, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing Semiconductor Device