Patent Assignment
Reel/Frame 056804/0180
Assignment of Assignor's Interest
Recorded: 2021-07-09
Pages: 2
Assignor
BEAN, REGINALD D.
Executed: 2021-06-28
Assignee
ROCKWELL COLLINS, INC.
400 COLLINS ROAD, NE, CEDAR RAPIDS, IOWA, 52498
Covered Property
(1)
Method and Apparatus for Through Interposer Die Level Interconnect with Thermal Management