Patent Assignment
Reel/Frame 056814/0052
Assignment of Assignor's Interest
Recorded: 2021-07-12
Pages: 5
Assignee
CHANGXIN MEMORY TECHNOLOGIES, INC.
NO.388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK, ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA,, HEFEI, CHINA
Covered Property
(1)
Method for Packaging Semiconductor, Semiconductor Package Structure, and Package