Patent Assignment
Reel/Frame 056829/0435
Assignment of Assignor's Interest
Recorded: 2021-07-12
Pages: 4
Assignors
WU, CHENG-HSUAN
Executed: 2021-07-05
LIN, CHANG-YU
Executed: 2021-07-05
HUANG, YU-SHENG
Executed: 2021-07-05
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANZIH DIST., KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Optoelectronic Package Structure and Method of Manufacturing the Same