Patent Assignment
Reel/Frame 056838/0035
Assignment of Assignor's Interest
Recorded: 2021-07-13
Pages: 8
Assignors
DELACRUZ, JAVIER A.
Executed: 2020-11-03
HABA, BELGACEM
Executed: 2018-06-28
UZOH, CYPRIAN EMEKA
Executed: 2018-06-28
KATKAR, RAJESH
Executed: 2018-08-09
MOHAMMED, ILYAS
Executed: 2018-06-27
Assignee
XCELSIS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Systems and Methods for Releveled Bump Planes for Chiplets
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Sep 2, 2022
From: XCELSIS CORPORATION
To: ADEIA SEMICONDUCTOR INC.
Reel/Frame 061375/0309 →
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →