Patent Assignment
Reel/Frame 056843/0040
Assignment of Assignor's Interest
Recorded: 2021-07-13
Pages: 2
Assignor
BIRKNER, ANDREAS
Executed: 2021-07-06
Assignee
INTEGRATED DYNAMICS ENGINEERING GMBH
HERMANNSTRASSE 9-13, RAUNHEIM, 65479, GERMANY
Covered Property
(1)
Method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine