Patent Assignment
Reel/Frame 056843/0474
Assignment of Assignor's Interest
Recorded: 2021-07-13
Pages: 6
Assignors
HOFER, MANUEL
Executed: 2021-06-29
PACHER FERNANDES, RODRIGO
Executed: 2021-06-29
HATZL, STEFAN LEOPOLD
Executed: 2021-06-29
EHGARTNER, JOSEF
Executed: 2021-07-12
BAINSCHAB, PETER
Executed: 2021-07-01
Assignee
RF360 EUROPE GMBH
ANZINGER STR. 13, MUNCHEN, 81671, GERMANY
Covered Property
(1)
Micro-Acoustic Wafer-Level Package and Method of Manufacture
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.