Patent Assignment
Reel/Frame 056850/0974
Assignment of Assignor's Interest
Recorded: 2021-07-14
Pages: 4
Assignors
CHEN, TING-YEH
Executed: 2021-06-09
CHEN, YEN-TING
Executed: 2021-06-09
LEE, WEI-YANG
Executed: 2021-06-09
LIN, CHIA-PIN
Executed: 2021-07-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device with Backside Contact and Methods of Forming Such