Patent Assignment
Reel/Frame 056851/0529
Assignment of Assignor's Interest
Recorded: 2021-07-14
Pages: 4
Assignors
CHEN, CHIH-HAO
Executed: 2021-07-13
CHEN, HUNG-YU
Executed: 2021-07-13
WANG, PU
Executed: 2021-07-13
CHENG, LI-HUI
Executed: 2021-07-13
LU, SZU-WEI
Executed: 2021-07-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
High Efficiency Heat Dissipation Using Thermal Interface Material Film