Patent Assignment
Reel/Frame 056868/0264
Assignment of Assignor's Interest
Recorded: 2021-07-15
Pages: 5
Assignors
LEE, DONGYUP
Executed: 2021-06-03
HEO, JOON
Executed: 2021-06-03
AN, JUNGCHUL
Executed: 2021-06-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Including Flexible Printed Circuit Board