Patent Assignment
Reel/Frame 056871/0450
Assignment of Assignor's Interest
Recorded: 2021-07-15
Pages: 4
Assignor
SVTECHNET LLC
Executed: 2021-07-13
Assignee
SDEP CORP.
48, DAEHAK-RO, YEONGTONG-GU, SUWON-SI, SUITE A-204, GYEONGGI-DO, 16226, KOREA, REPUBLIC OF
Covered Properties
(7)
Hybrid Multifunction Component System with Component Interface Encapsulation Including Os Packet Translator for Communication Over Unified Data Bus Architecture
Computationally-Networked Unified Data Bus
Memory and Process Sharing Across Multiple Chipsets via Input/Output with Virtualization
Memory and Process Sharing via Input/Output with Virtualization
Self-Organizing Network with Chip Package Having Multiple Interconnection Configurations
Input/Output Device Power Reduction and Optimization by Enablement or Disablement of an External Circuit Coupled to the Input/Output Device
Leakage and Performance Graded Memory
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.