Patent Assignment
Reel/Frame 056873/0168
Assignment of Assignor's Interest
Recorded: 2021-07-15
Pages: 4
Assignors
CHANG, CHI-MIN
Executed: 2021-06-28
CHEN, CHING-SHENG
Executed: 2021-06-28
HUANG, JUN-RUI
Executed: 2021-06-28
LIAO, WEI-YU
Executed: 2021-06-28
LIN, YI-PIN
Executed: 2021-06-28
Assignee
UNIMICRON TECHNOLOGY CORP.
NO.38, XINGBANG RD., GUISHAN IND. PARK, TAOYUAN, 330, TAIWAN
Covered Property
(1)
Interlayer Connective Structure of Wiring Board and Method of Manufacturing the Same