Patent Assignment
Reel/Frame 056878/0287
Assignment of Assignor's Interest
Recorded: 2021-07-16
Pages: 5
Assignors
LAI, PO-CHEN
Executed: 2020-09-22
WANG, CHIN-HUA
Executed: 2020-09-22
YEW, MING-CHIH
Executed: 2020-09-22
HSU, CHIA-KUEI
Executed: 2020-09-22
LIAO, LI-LING
Executed: 2020-09-22
LIN, PO-YAO
Executed: 2020-09-22
JENG, SHIN-PUU
Executed: 2020-09-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure and Method for Forming the Same