Patent Assignment
Reel/Frame 056893/0866
Assignment of Assignor's Interest
Recorded: 2021-07-19
Pages: 5
Assignors
YOO, JOUNGEUN
Executed: 2021-03-25
KANG, YOUNGJAE
Executed: 2021-03-25
YOON, DUSEOP
Executed: 2021-03-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wiring Material for Semiconductor Device, Wiring for Semiconductor Device Including the Same, and Semiconductor Device Including the Wiring