Patent Assignment
Reel/Frame 056898/0592
Assignment of Assignor's Interest
Recorded: 2021-07-19
Pages: 4
Assignors
LEE, HYUEKJAE
Executed: 2021-06-02
KIM, DAE-WOO
Executed: 2021-06-02
SONG, EUNSEOK
Executed: 2021-05-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package