Patent Assignment
Reel/Frame 056899/0986
Assignment of Assignor's Interest
Recorded: 2021-07-19
Pages: 2
Assignee
HIGHCON SYSTEMS LTD.
4 PARAN ST., YAVNE, ISRAEL
Covered Properties
(2)
Polymeric Rule Die, and Formulations Therefor
Polymeric Rule Die, and Formulations Therefor
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Apr 9, 2017
From: HIGHCON SYSTEMS LTD
To: BANK LEUMI LE-ISRAEL B.M.
Reel/Frame 042214/0294 →
Addendum to Ip Security Interest; Reel/Frame: 0442214/0294
Oct 24, 2017
From: HIGHCON SYSTEMS LTD
To: BANK LEUMI LE-ISRAEL B.M.
Reel/Frame 044279/0943 →
Assignment of Assignor's Interest
Dec 10, 2019
From: ZLOTNIKOV, NATALIA; ROTTMAN, CLAUDIO
To: HIGHCON SYSTEMS LTD.
Reel/Frame 051233/0495 →
Release of Security Interest
Jan 12, 2020
From: BANK LEUMI LE-ISRAEL B.M.
To: HIGHCON SYSTEMS LTD.
Reel/Frame 051567/0984 →
Assignment of Assignor's Interest
Jul 20, 2021
From: ZLOTNIKOV, NATALIA; ROTTMAN, CLAUDIO
To: HIGHCON SYSTEMS LTD.
Reel/Frame 056919/0148 →