Patent Assignment
Reel/Frame 056915/0669
Assignment of Assignor's Interest
Recorded: 2021-07-20
Pages: 3
Assignor
LUAN, JING-EN
Executed: 2020-06-19
Assignee
STMICROELECTRONICS PTE LTD
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Wafer Level Chip Scale Packaging with Sensor
Application:
17/344,576 →
Publication:
US 2021/0395077