Patent Assignment
Reel/Frame 056923/0366
Assignment of Assignor's Interest
Recorded: 2021-07-20
Pages: 4
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANZIH DIST., KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Semiconductor Device, Semiconductor Device Package and Method of Manufacturing the Same