Patent Assignment
Reel/Frame 056923/0373
Assignment of Assignor's Interest
Recorded: 2021-07-20
Pages: 3
Assignor
LO, PEI-JEN
Executed: 2021-07-19
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANZIH DIST., KAOHSIUNG, 811, TAIWAN
Covered Property
(1)
Electronic Device, Package Structure and Electronic Manufacturing Method