Patent Assignment
Reel/Frame 056937/0103
Assignment of Assignor's Interest
Recorded: 2021-07-21
Pages: 3
Assignors
HSIEH, PING-YIN
Executed: 2021-07-19
WANG, PU
Executed: 2021-07-15
CHENG, LI-HUI
Executed: 2021-07-15
LU, SZU-WEI
Executed: 2021-07-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Multi-TIM Packages and Method Forming Same
Application:
17/381,952 →
Publication:
US 2022/0359339