Patent Assignment
Reel/Frame 056937/0673
Assignment of Assignor's Interest
Recorded: 2021-07-21
Pages: 6
Assignors
PARK, SANG CHEON
Executed: 2021-06-09
KIM, DAE-WOO
Executed: 2021-06-09
KIM, TAEHUN
Executed: 2021-06-09
LEE, HYUEKJAE
Executed: 2021-06-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package