Patent Assignment
Reel/Frame 056939/0978
Assignment of Assignor's Interest
Recorded: 2021-07-21
Pages: 3
Assignor
LAI, CHIEN-MING
Executed: 2021-07-16
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Structure for Wafer Level Bonding and Bonded Semiconductor Structure